Fetching the paper…

Reading the bibliography…

2017

Superconducting Caps for Quantum Integrated Circuits

O'Brien, William, Vahidpour, Mehrnoosh, Whyland, Jon Tyler et al.

Original
PDF
Post on X

Understand

We report on the fabrication and metrology of superconducting caps for qubit circuits.

As part of a 3D quantum integrated circuit architecture, a cap chip forms the upper half of an enclosure that provides isolation, increases vacuum participation ratio, and improves performance of individual resonant elements.
Here, we demonstrate that such caps can be reliably fabricated, placed on a circuit chip, and form superconducting connections to the circuit.

Superconducting Caps for Quantum Integrated Circuits · Around

Built on

F. Marty, L. Rousseau, B. Saadany, B. Mercier, O. Francais, Y. Mita, T. Bourouina, Advanced etching of silicon based on deep reactive ion etching for silicon high aspect ratio microstructures and three-dimensional micro- and nanostructures, Microelectronics Journal 36
2005
Earlier work this paper cites.
Hanhee Paik, et al., Observation of High Coherence in Josephson Junction Qubits Measured in a Three-Dimensional Circuit QED Architecture, Phys. Rev. Lett. 107
2011
Earlier work this paper cites.

Similar

D. Rosenberg, et al., 3D integrated superconducting qubits, arXiv:1706.04116 (2017)
Original
2017
Cited alongside, same era.
M. Mohseni, et. al., Commercialize quantum technologies in five years, Nature 543
2017
Cited alongside, same era.

Then

J. Mutus, et. al., H46.00006: 3D integration of superconducting qubits with bump bonds: Part 1, J. Kelly, et. al., H46.00007: 3D integration of superconducting qubits with bump bonds: Part 2, E. Lucero, et. al., H46.00008: 3D integration of superconducting qubits with bump bonds: Part 3, APS March Meeting 2017
Original
2017
Closest in time.

Beyond the bibliography

alphaXiv searches the wider corpus for related work and actual follow-ups.

Open on alphaXiv

alphaXiv is searching for related work…