Extensible 3D architecture for superconducting quantum computing

Understand

Using a multi-layered printed circuit board, we propose a 3D architecture suitable for packaging supercon- ducting chips, especially chips that contain two-dimensional qubit arrays.

• In our proposed architecture, the center strips of the buried coplanar waveguides protrude from the surface of a dielectric layer as contacts.
• Since the contacts extend beyond the surface of the dielectric layer, chips can simply be flip-chip packaged with on-chip receptacles clinging to the contacts.
• Using this scheme, we packaged a multi-qubit chip and per- formed single-qubit and two-qubit quantum gate operations.