Kinetics of Electrodeposition of Silver and Copper at Template Synthesis of Nanowires

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The results of investigation of kinetics of nanopores filling into membranes from aluminum oxide (pore diameter - 200 nm, porosity ~ 50%) at electrodeposition of copper and silver are described.

• It is shown, that at identical quantity of electricity passed through solutions, the degree of pores filling by metal (average thickness of a deposit) is various for copper and silver deposition.
• Calculated (according Faraday Law) and experimental dependences of deposition rates of these metals on quantity of electricity passed at direct and pulse currents are presented.
• Galvanodynamic i - v dependences have been obtained at various current scanning rates.